Thin film transistor, method of manufacturing the thin film transistor and organic light emitting display device have the thin film transistor

ABSTRACT

A thin film transistor for an organic light emitting display device is disclosed. In one embodiment, the thin film transistor includes: a substrate, an active layer formed over the substrate, wherein the active layer is formed of an oxide semiconductor, a gate insulating layer formed over the substrate and the active layer, and source and drain electrodes formed on the gate insulating layer and electrically connected to the active layer. The transistor may further include a gate electrode formed on the gate insulating layer and formed between the source and drain electrodes, wherein the gate electrode is spaced apart from the source electrode so as to define a first offset region therebetween, and wherein the gate electrode is spaced apart from the drain electrode so as to define a second offset region therebetween. The transistor may further include a passivation layer formed on i) the gate insulating layer, ii) the source and drain electrodes and iii) the gate electrode; and at least one auxiliary gate electrode formed on the passivation layer, wherein at least a portion of the auxiliary gate electrode is located directly above the first and second offest regions.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of Korean PatentApplication No. 10-2009-0096759, filed on Oct. 12, 2009, in the KoreanIntellectual Property Office, the entire content of which isincorporated herein by reference.

This application relates to U.S. patent application entitled “Thin filmtransistor, method of manufacturing the thin film transistor and organiclight emitting display device having thin film transistor” (Attorneydodcket: SMDSHN.153AUS), which is concurrently filed as this applicationand incorporated herein by reference in its entirety.

BACKGROUND

1. Field of the Invention

Embodiments relate to a thin film transistor using an oxidesemiconductor as an active layer, a method of manufacturing the thinfilm transistor, and an organic light emitting display device having thethin film transistor. M ore particularly, embodiments relate to a thinfilm transistor having an auxiliary gate electrode, a method ofmanufacturing the thin film transistor, and an organic light emittingdisplay device having the thin film transistor.

2. Discussion of the Related Technology

In general, a thin film transistor includes an active layer providing achannel region, a source region, and a drain region and a gate electrodethat is superimposed on the channel region and is insulated from theactive layer by a gate insulating layer.

SUMMARY OF CERTAIN INVENTIVE ASPECTS

One aspect is a thin film transistor of which electrical characteristicscan be improved, a method of manufacturing the thin film transistor, andan organic light emitting display device having the thin filmtransistor.

Another aspect is a thin film transistor capable of reducing the numberof masks used in a manufacturing process, a method of manufacturing thethin film transistor, and an organic light emitting display devicehaving the thin film transistor.

Another aspect is a thin film transistor which includes: a substrate; anactive layer formed on the substrate by an oxide semiconductor; a gateinsulating layer formed on the substrate including the active layer;source and drain electrodes formed on the gate insulating layer toconnect the active layer; a gate electrode formed on the gate insulatinglayer between the source and drain electrodes; a passivation layerformed on the gate insulating layer including the source and drainelectrodes and the gate electrode; and auxiliary gate electrodes formedon the passivation layer to correspond to offset regions between thesource and drain electrodes and the gate electrode.

Another aspect is a method of manufacturing a thin film transistor whichincludes: forming an active layer on the substrate by an oxidesemiconductor; forming a gate insulating layer on the substrateincluding the active layer; forming source and drain electrodesconnected to the active layer on the gate insulating layer and a gateelectrode disposed between the source and drain electrodes; forming apassivation layer on the gate insulating layer including the source anddrain electrodes and the gate electrode; and forming auxiliary gateelectrodes on the passivation layer to correspond to offset regionsbetween the source and drain electrode and the gate electrode.

Another aspect is an organic light emitting display device having a thinfilm transistor which includes: a first substrate where an organic lightemitting device constituted by a first electrode, an organic lightemitting layer, and a second electrode and a thin film transistor forcontrolling an operation of the organic light emitting device; and asecond substrate disposed to face the first substrate, wherein the thinfilm transistor includes an active layer formed on the first substrateby an oxide semiconductor; a gate insulating layer formed on the firstsubstrate including the active layer; source and drain electrodes formedon the gate insulating layer to connect the active layer; a passivationlayer formed on the gate insulating layer including the source and drainelectrodes and the gate electrode; and auxiliary gate electrodes formedon the passivation layer to correspond to offset regions between thesource and drain electrodes and the gate electrode.

Another aspect is a thin film transistor which includes a gate electrodeformed between a source electrode and a drain electrode and an auxiliarygate electrode formed to corresponding to an offset region between thesource and drain electrodes and the gate electrode. An electric filed isapplied even to the offset region between the source and drainelectrodes and the gate electrode by bias voltage applied to theauxiliary gate electrode, such that a channel is additionally formed onan active layer, thereby improving current characteristics in comparisonwith a known thin film transistor. Further, in the thin film transistorof the present invention, since the source and drain electrodes and thegate electrode are formed by the same material on the same plane, thesource and drain electrodes and the gate electrode can be simultaneouslyformed by using one mask. Accordingly, a manufacturing cost is saved byreducing the number of masks used in a manufacturing process. Anotheraspect is a thin film transistor, comprising: a substrate; an activelayer formed over the substrate, wherein the active layer is formed ofan oxide semiconductor; a gate insulating layer formed over thesubstrate and the active layer; source and drain electrodes formed onthe gate insulating layer and electrically connected to the activelayer; a gate electrode formed on the gate insulating layer and formedbetween the source and drain electrodes, wherein the gate electrode isspaced apart from the source electrode so as to define a first offsetregion therebetween, and wherein the gate electrode is spaced apart fromthe drain electrode so as to define a second offset region therebetween;a passivation layer formed on i) the gate insulating layer, ii) thesource and drain electrodes and iii) the gate electrode; and at leastone auxiliary gate electrode formed on the passivation layer, wherein atleast a portion of the auxiliary gate electrode is located directlyabove the first and second offest regions.

In the above transistor, the source and drain electrodes areelectrically connected to the active layer through a contact hole formedon the gate insulating layer. In the above transistor, the oxidesemiconductor contains zinco oxide (ZnO). In the above transistor, theoxide semiconductor comprises at least one ion of: gallium (Ga), indium(In), stanium (Sn), zirconium (Zr), hafnium (Hf), cadmium (Cd),magnesium (Mg), and vanadium (V). In the above transistor, the oxidesemiconductor comprises at least one ion of 1-group elements, 13-groupelements, 14-group elements, 15-group elements, and 17-group elements.In the above transistor, the at least one auxiliary gate electrodecomprises first and second auxiliary gate electrodes which are spacedapart from each other, wherein at least a portion of the first auxiliarygate electrode is located directly above the first offest region, andwherein at least a portion of the second auxiliary gate electrode islocated directly above the second offest region.

Another aspect is a thin film transistor, comprising: a substrate;source and drain electrodes formed over the substrate; a gate electrodeformed over the substrate and formed between the source and drainelectrodes, wherein the gate electrode is spaced apart from the sourceelectrode so as to define a first offset region therebetween, andwherein the gate electrode is spaced apart from the drain electrode soas to define a second offset region therebetween; a gate insulatinglayer covering the gate electrode; an active layer formed on i) the gateinsulating layer , ii) the source and drain electrodes and iii) at leastpart of the first and second offset regions; a passivation layer formedon the active layer; and at least one auxiliary gate electrode formed onthe passivation layer, wherein at least a portion of the auxiliary gateelectrode is located directly above the first and second offest regions.

In the above transistor, at least part of the auxiliary gate electrodeoverlaps with the gate electrode. In the above transistor, the at leastone auxiliary gate electrode is a single piece electrode. In the abovetransistor, the source and drain electrodes and the gate electrode aremade of the same material. In the above transistor, the oxidesemiconductor contains zinc oxide (ZnO).

Another aspect is a method of manufacturing a thin film transistor,comprising: forming an semiconductor active layer over a substrate;forming a gate insulating layer over the substrate and the active layer;forming i) source and drain electrodes, electrically connected to theactive layer, on the gate insulating layer and ii) a gate electrodebetween the source and drain electrodes, wherein the gate electrode isspaced apart from the source electrode so as to define a first offsetregion therebetween, and wherein the gate electrode is spaced apart fromthe drain electrode so as to define a second offset region therebetween;forming a passivation layer on i) the gate insulating layer, ii) thesource and drain electrodes and iii) the gate electrode; and forming atleast one auxiliary gate electrode on the passivation layer, wherein atleast a portion of the auxiliary gate electrode is located directlyabove the first and second offest regions.

In the above method, the forming the source and drain electrodes, andthe gate electrode comprises: forming a contact hole on the gateinsulating layer to expose a predetermined part of the active layer;forming a conductive layer on the gate insulating layer to fill thecontact hole; and forming the source and drain electrodes and the gateelectrode by patterning the conductive layer. In the above method, theat least one auxiliary gate electrode comprises first and secondauxiliary gate electrodes which are spaced apart from each other,wherein at least a portion of the first auxiliary gate electrode islocated directly above the first offest region, and wherein at least aportion of the second auxiliary gate electrode is located directly abovethe second offest region. In the above method, at least a portion of theauxiliary gate electrode overlaps with the gate electrode.

Another aspect is an organic light emitting display device, comprising:a first substrate; a second substrate disposed to face the firstsubstrate, an organic light emitting device interposed between the firstand second subtrates, wherein the organic light emitting devicecomprises a first electrode, an organic light emitting layer, a secondelectrode and a thin film transistor configured to control an operationof the organic light emitting device; and wherein the thin filmtransistor comprises: a substrate; an active layer formed over thesubstrate, wherein the active layer is formed of an oxide semiconductor;a gate insulating layer formed over the substrate and the active layer;source and drain electrodes formed on the gate insulating layer andelectrically connected to the active layer; a gate electrode formed onthe gate insulating layer and formed between the source and drainelectrodes, wherein the gate electrode is spaced apart from the sourceelectrode so as to define a first offset region therebetween, andwherein the gate electrode is spaced apart from the drain electrode soas to define a second offset region therebetween; a passivation layerformed on i) the gate insulating layer, ii) the source and drainelectrodes and iii) the gate electrode; and at least one auxiliary gateelectrode formed on the passivation layer, wherein at least a portion ofthe auxiliary gate electrode is located directly above the first andsecond offest regions.

In the above device, the source and drain electrodes are electricallyconnected to the active layer through a contact hole formed on the gateinsulating layer. In the above device, at least part of the auxiliarygate electrode overlaps with the gate electrode. In the above device,the at least one auxiliary gate electrode comprises first and secondauxiliary gate electrodes which are spaced apart from each other,wherein at least a portion of the first auxiliary gate electrode islocated directly above the first offest region, and wherein at least aportion of the second auxiliary gate electrode is located directly abovethe second offest region. In the above device, the auxiliary gateelectrode and the first electrode are made of the same material on thesame plane.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are cross-sectional views showing a thin film transistorhaving a top gate structure according to an embodiment of the presentinvention.

FIG. 2A is a graph showing a variation (transfer curve) of drain currentI_(D) according to gate voltage V_(G).

FIG. 2B is a graph showing a variation (transfer curve) of drain currentI_(DS) according to drain voltage V_(DS).

FIGS. 3A and 3B are cross-sectional views for describing a thin filmtransistor having a bottom gate structure according to an embodiment ofthe present invention.

FIGS. 4A-4D are cross-sectional views for describing a method ofmanufacturing a thin film transistor according to an embodiment of thepresent invention.

FIGS. 5A and 5B are a plan view and a cross-sectional view for showingone embodiment of an organic light emitting display device having a thinfilm transistor according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view for describing an organic lightemitting device of FIG. 5A.

DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS

An active layer of a thin film transistor is generally made of asemiconductor material such as amorphous silicon or poly-silicon.However, when the active layer is made of the amorphous silicon, sincemobility is low, it is difficult to implement a driving circuit thatoperates at high speed. Further, when the active layer is made of thepoly-silicon, although the mobility is high, since threshold voltage isnon-uniform, an additional compensation circuit needs to be added.

Further, since a method of manufacturing the thin film transistor usinglow temperature poly-silicon (LTPS) includes a high-price process suchas laser processing, etc., it is difficult to control characteristics,and thus the method is difficult to be applied to a large-areasubstrate.

Japanese Unexamined Patent Publication No. 2004-273614 discloses a thinfilm transistor using zinc oxide (ZnO) or an oxide semiconductorcontaining zinc oxide (ZnO) as a principle ingredient as an activelayer.

The oxide semiconductor containing zinc oxide (ZnO) as the principleingredient is evaluated as a stable material while having an amorphousform. When using the oxide semiconductor as the active layer, it ispossible to manufacture the thin film transistor at low temperature byusing the existing process equipment without additionally purchasing anadditional process equipment and an ion injection process is omitted.

However, since the thin film transistor using the oxide semiconductor asthe active layer is easily changed in electrical characteristics inaccordance with a structure and a process condition, the thin filmtransistor has low reliability. In particular, current characteristicsare deteriorated while static-voltage or static-current driving to varythe threshold voltage, thereby deteriorating the electricalcharacteristics.

In the following detailed description, only certain exemplaryembodiments of the present invention have been shown and described,simply by way of illustration. As those skilled in the art wouldrealize, the described embodiments may be modified in various differentways, all without departing from the spirit or scope of the presentinvention. Accordingly, the drawings and description are to be regardedas illustrative in nature and not restrictive. In addition, when anelement is referred to as being “on” another element, it can be directlyon the another element or be indirectly on the another element with oneor more intervening elements interposed therebetween. Also, when anelement is referred to as being “connected to” another element, it canbe directly connected to the another element or be indirectly connectedto the another element with one or more intervening elements interposedtherebetween. Hereinafter, like reference numerals refer to likeelements.

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. Hereinafter,embodiments are provided to be understood to those skilled in the artand can be varied in various forms and the scope of the presentinvention is not limited to the embodiments to be described below.

FIGS. 1A and 1B are cross-sectional views for describing one embodimentof a thin film transistor according to an embodiment of the presentinvention.

In one embodiment, as shown in FIG. 1A, a buffer layer 11 is formed on asubstrate 10 and an active layer 12 as an oxide semiconductor is formedon the buffer layer 11. The active layer 12 includes a channel region, asource region, and a drain region.

In one embodiment, a gate insulating layer 13 is formed on the activelayer 12 and the substrate 10. Source and drain electrodes 14 b and 14 cmay be electrically connected to the source and drain regions of theactive layer 12. A gate electrode 14 a may be disposed between thesource and drain electrodes 14 b and 14 c and may be formed on the gateinsulating layer 13. In one embodiment, the source and drain electrodes14 b and 14 c are electrically connected to the source and drain regionsof the active layer 12 through a contact hole formed on the gateinsulating layer 13. The source and drain electrodes 14 b and 14 c maybe spaced from the gate electrode 14 a by a predetermined distance(hereinafter, the area between the source electrode 14 b and gateelectrode 14 a, and the area between the gate electrode 14 a and thedrain electrode 14 c are referred to as an offset region, or a firstoffset region and a second offset region, respectively).

A passivation layer 15 may be formed on i) the source and drainelectrodes 14 b and 14 c and ii) the gate electrode 14 a. In oneembodiment, auxiliary gate electrodes 16 a and 16 b are formed on thepassivation layer 15. In one embodiment, at least a portion of theauxiliary gate electrode 16 a and at least a portion of the auxiliarygate electrode 16 b are located directly above the first and secondoffset regions, respectively, as shown in FIG. 1A. In one embodiment, atleast a portion of the auxiliary gate electrode 16 a and at least aportion of the auxiliary gate electrode 16 b overlap with the gateelectrode 14 a.

In another embodiment, as shown in FIG. 1B, a single auxiliary gateelectrode 16 may be formed on the passivation layer 15, instead of thetwo auxiliary gate electrodes 16 a and 16 b of the FIG. 1A embodiment.At least a portion of the auxiliary gate electrode 16 may be locateddirectly above the first offset region and at least another portion ofthe auxiliary gate electrode 16 may be located directly above the secondoffset region. At least a portion of the auxiliary gate electrode 16 maybe located directly above the gate electrode 14 a, as shown in FIG. 1B.

In one embodiment, bias voltage VG is applied to the gate electrode 14 aand the auxiliary gate electrodes 16 a and 16 b, and 16. One embodimentis advantageous compared to a thin film transistor having only one gateelectrode, where the bias voltage is applied to the gate electrode, anda channel is formed on an active layer below the gate electrode. In oneembodiment, since the channels are formed even on the first and secondoffset regions, which are located above the active layer 12 in additionto the active layer 12 below the gate electrode 14 a, currentcharacteristics are improved.

FIG. 2A is a graph showing a variation (transfer curve) of drain currentI_(D)s according to gate voltage V_(GS) and FIG. 2B is a graph showing avariation (transfer curve) of drain current I_(DS) according to drainvoltage V_(DS) of a thin film transistor according to an embodiment ofthe present invention.

As can be seen from the graph, the thin film transistor (solid line) ofone embodiment of the present invention has a threshold voltage (V_(TH))characteristic more improved than the thin film transistor which doesnot have an auxiliary gate electrode (dotted line).

Although the thin film transistor having the top gate structure has beendescribed, one embodiment includes a thin film transistor having abottom gate structure.

FIGS. 3A and 3B are cross-sectional views for describing a thin filmtransistor according to another embodiment of the present invention.

In one embodiment, as shown in FIG. 3A, a buffer layer 21 is formed on asubstrate 20. Source and drain electrodes 22 b and 22 c and a gateelectrode 22 a, disposed between the source and drain electrodes 22 band 22 c, may be formed on the buffer layer 21. The area between thesource electrode 22 b and gate electrode 22 a, and the area between thegate electrode 22 a and the drain electrode 22 c are referred to as anoffset region, or a first offset region and a second offset region,respectively.

In one embodiment, a gate insulating layer 23 is formed to substantiallycompletely cover the gate electrode 22 a. An active layer 24, formed of,e.g., an oxide semiconductor, may be formed on i) the gate insulatinglayer 23, ii) the source and drain electrodes 22 b and 22 c, and iii) atleast part of the offset region. The active layer 24 may include achannel region, a source region, and a drain region. The source regionmay be electrically connected to the source electrode 22 b and the drainregion may be electrically connected to the drain electrode 22 c.

A passivation layer 25 may be formed on the active layer 24. In oneembodiment, auxiliary gate electrodes 26 a and 26 b are formed on thepassivation layer 25. Similarly to the FIG. 1 embodiment, at leastportions of the auxiliary gate electrodes 26 a and 26 b may be locateddirectly above the offset region, and at least a portion of theauxiliary gate electrodes 26 a and 26 b may overlap with the gateelectrode 22 a, as shown in FIG. 3A.

In another embodiment, as shown in FIG. 3B, a single auxiliary gateelectrode 26 may be formed on the passivation layer 25, instead of thetwo auxiliary gate electrodes 26 a and 26 b. At least portions of theauxiliary gate electrode 26 may be located directly above the offsetregion, and at least a portion of the auxiliary gate electrode 26 may belocated directly above the gate electrode 22 a, as shown in FIG. 3B.

Similarly to the FIG. 1 embodiment, since the channels are formed evenon the first and second offset regions, as well as the active layer 24above the gate electrode 22 a, current characteristics are improved.

FIGS. 4A and 4B are cross-sectional views for describing a method ofmanufacturing a thin film transistor according to an embodiment of thepresent invention and describe the thin film transistor the top gatestructure shown in FIG. IA as an example.

In one embodiment, as shown in FIG. 4A, a buffer layer 11 is formed on asubstrate 10 and an active layer 13 providing a channel region, a sourceregion, and a drain region is formed on the buffer layer 11.

A semiconductor substrate made of, for example, silicon (Si), aninsulating substrate made of, e.g., glass, plastic, or the like, or ametallic substrate may be used as the substrate 10. The buffer layer 11may be made of, e.g., a silicon oxide, a silicon nitride, a compound ofthe silicon oxide and the silicon nitride, or the like. The active layer13 may be formed by evaporating the oxide semiconductor of an amorphous,polycrystalline, or microcrystalline state using, for example, asputtering method. The oxide semiconductor contains zinco oxide (ZnO)and at least one ion of gallium (Ga), indium (In), stanium (Sn),zirconium (Zr), hafnium (Hf), cadmium (Cd), magnesium (Mg), and vanadium(V) may be doped on the zinco oxide (ZnO) or at least one ion of 1-groupelements (Li, Na, K, Rb, and Cs), 13-group elements (B, Ga, In, and Ti),14-group elements (C, Si, Ge, Sn, and Pb), 15-group elements (N, P, As,Sb, and Bi), and 17-group elements (F, Cl, Br, and I) may be doped onthe zinco oxide (ZnO). The active layer 12 may have a thickness of about25 nm to about 200 nm, or, a thickness of about 30 nm to about 150 nm.In another embodiment, the active layer 12 may have a thickness lessthan about 25 nm or greater than about 200 nm.

In one embodiment, as shown in FIG. 4B, a contact hole 13 a is formed toexpose the source region and the drain region of the active layer 12 byforming and patterning a gate insulating layer 13. The gate insulatinglayer 13 may be made of, e.g., the silicon oxide, the silicon nitride,the compound of the silicon oxide and the silicon nitride, or the like.

In one embodiment, as shown in FIG. 4C, the source and drain electrodes14 b and 14 c are formed such that the electrodes 14 b and 14 c areconnected to the source and drain regions of the active layer 12. Thegate electrode 14 a may be formed to be disposed between the source anddrain electrodes 14 b and 14 c. The electrodes 14 a-14 c may be formedby depositing and patterning a conductive layer on the gate insulatinglayer 13 and burying the contact hole 13 a. The source and drainelectrodes 14 b and 14 c may be spaced apart from the gate electrode 14a by the offset region D.

The conductive layer may be formed by evaporating metal, including, butnot limited to, tungsten (W), titanium (Ti), molybdenum (Mo), tantalnyum(Ta), aluminum (Al), copper (Cu), gold (Au), chrome (Cr), niobium (Nb),or the like or alloys of the metals by using the sputtering method ormay be formed of a doped semiconductor or transparent electrodematerials made of ITO, IZO, ITSO, In₂O₃, AlZnO, GaZnO, ZnO, etc. Thesource and drain electrodes 14 b and 14 c and the gate electrode 14 amay have a thickness of about 100 nm to about 200 nm.

In one embodiment, as shown in FIG. 4D, the passivation layer 15 isformed on i) the source and drain electrodes 14 b and 14 c, ii) the gateelectrode 14 a and iii) the gate insulating layer 13. In one embodiment,auxiliary gate electrodes 16 a and 16 b, having the configuration of theFIG. 1A embodiment, are formed on the passivation layer 15. Theauxiliary gate electrodes 16 a and 16 b may be formed of, e.g., themetal, the doped semiconductor, or the transparent electrode materialused for forming the conductive layer.

In one embodiment, the above described thin film transistor can be usedfor an organic light emitting display device.

FIGS. 5A and 5B are a plan view and a cross-sectional view for showingone embodiment of an organic light emitting display device having a thinfilm transistor according to an embodiment of the present invention andprimarily describe a display panel 200 displaying an image.

In one embodiment, as shown in FIG. 5A, a substrate 210 is defined by apixel region 220 and a non-pixel region 230 in the vicinity of the pixelregion 220. A plurality of organic light emitting devices 300 connectedbetween a scan line 224 and a data line 226 in a matrix form may beformed on the substrate 210 in the pixel region 220 and connected to thescan line 224 and the data line 226 extending from the scan line 224. Apower supply line (not shown), and a scan driver 234 and a data driver236, which process a signal provided from the outside through a pad 228and supply the processed signal to the scan line 224 and the data line226, may be formed on the substrate 210 in the non-pixel region 230.

In one embodiment, as shown in FIG. 6, the organic light emitting device300 includes an anode electrode 16 c, a cathode electrode 19, and anorganic light emitting layer 18 formed between the anode electrode 16 cand the cathode electrode 19. The organic light emitting layer 18 mayfurther include a hole injection layer, a hole transport layer, anelectron transport layer, and an electron injection layer. Further, theorganic light emitting layer 18 may further include a thin filmtransistor for controlling an operation of the organic light emittingdevice 300 and a capacitor for maintaining a signal.

The thin film transistor has the top gate structure shown in FIGS. 1Aand 1B or the bottom gate structure shown in FIGS. 3A and 3B and can bemanufactured by the manufacturing method of the present invention byreferring to FIGS. 4A to 4D.

Hereinafter, the organic light emitting device 300 including the thinfilm transistor configured as above will be described in more detailwith reference to FIGS. 5A and 6. For convenience of description, thethin film transistor having the top gate structure shown in FIG. 1A willbe described as an example.

The buffer layer 11 may be formed on the substrate 210 and the activelayer 12, made of, e.g., an oxide semiconductor, may be formed on thebuffer layer 11. A gate insulating layer 13 may be formed on i) theactive layer 12 and ii) source and drain electrodes 14 b and 14 c,electrically connected to the source and drain regions of the activelayer 12. A gate electrode 14 a, disposed between the source and drainelectrodes 14 b and 14 c, may be formed on the gate insulating layer 13.

The passivation layer 15 may be formed on i) the source and drainelectrodes 14 b and 14 c, ii) the gate insulating layer 13, and the gateelectrode 14 a. A via-hole may be formed on the passivation layer 15 toexpose the source or drain electrode 14 b or 14 c.

The auxiliary gate electrodes 16 a and 16 b may be formed on thepassivation layer 15 corresponding to the offset region The anodeelectrode 16 c, electrically connected to the source or drain electrode14 b or 14 c through the via-hole, may be formed on the passivationlayer 15 of the pixel region 220. In one embodiment, since the auxiliarygate electrodes 16 a and 16 b and the anode electrode 16 c can be formedof the same material on the same plane, the number of masks can bereduced.

A pixel definition layer 17 may be formed on the passivation layer 15and the anode electrode 16 c so as to expose a partial region (lightemitting region) of the anode electrode 16 c. The organic light emittinglayer 18 may be formed on the exposed anode electrode 16 c. In addition,the cathode electrode 19 may be formed on the pixel definition layer 17and the organic light emitting layer 18.

In one embodiment, as shown in FIG. 5B, a sealing substrate 400 forsealing the pixel region 220 is disposed on the top of the substrate 210where the organic light emitting device 300 is formed and the sealingsubstrate 400 is bonded onto the substrate 210 by a sealing material 410to form the display panel 200.

While the present invention has been described in connection withcertain exemplary embodiments, it is to be understood that the inventionis not limited to the disclosed embodiments, but, on the contrary, isintended to cover various modifications and equivalent arrangementsincluded within the spirit and scope of the appended claims,and-equivalents thereof.

1. A thin film transistor, comprising: a substrate; an active layerformed over the substrate, wherein the active layer is formed of anoxide semiconductor; a gate insulating layer formed over the substrateand the active layer; source and drain electrodes formed on the gateinsulating layer and electrically connected to the active layer; a gateelectrode formed on the gate insulating layer and formed between thesource and drain electrodes, wherein the gate electrode is spaced apartfrom the source electrode so as to define a first offset regiontherebetween, and wherein the gate electrode is spaced apart from thedrain electrode so as to define a second offset region therebetween; apassivation layer formed on i) the gate insulating layer, ii) the sourceand drain electrodes and iii) the gate electrode; and at least oneauxiliary gate electrode formed on the passivation layer, wherein atleast a portion of the auxiliary gate electrode is located directlyabove the first and second offest regions.
 2. The thin film transistorof claim 1, wherein the source and drain electrodes are electricallyconnected to the active layer through a contact hole formed on the gateinsulating layer.
 3. The thin film transistor of claim 1, wherein theoxide semiconductor contains zinco oxide (ZnO).
 4. The thin filmtransistor of claim 3, wherein the oxide semiconductor comprises atleast one ion of: gallium (Ga), indium (In), stanium (Sn), zirconium(Zr), hafnium (Hf), cadmium (Cd), magnesium (Mg), and vanadium (V). 5.The thin film transistor of claim 3, wherein the oxide semiconductorcomprises at least one ion of: 1-group elements, 13-group elements,14-group elements, 15-group elements, and 17-group elements.
 6. The thinfilm transistor of claim 1, wherein the at least one auxiliary gateelectrode comprises first and second auxiliary gate electrodes which arespaced apart from each other, wherein at least a portion of the firstauxiliary gate electrode is located directly above the first offestregion, and wherein at least a portion of the second auxiliary gateelectrode is located directly above the second offest region.
 7. A thinfilm transistor, comprising: a substrate; source and drain electrodesformed over the substrate; a gate electrode formed over the substrateand formed between the source and drain electrodes, wherein the gateelectrode is spaced apart from the source electrode so as to define afirst offset region therebetween, and wherein the gate electrode isspaced apart from the drain electrode so as to define a second offsetregion therebetween; a gate insulating layer covering the gateelectrode; an active layer formed on i) the gate insulating layer, ii)the source and drain electrodes and iii) at least part of the first andsecond offset regions; a passivation layer formed on the active layer;and at least one auxiliary gate electrode formed on the passivationlayer, wherein at least a portion of the auxiliary gate electrode islocated directly above the first and second offest regions.
 8. The thinfilm transistor of claim 7, wherein at least part of the auxiliary gateelectrode overlaps with the gate electrode.
 9. The thin film transistorof claim 7, wherein the at least one auxiliary gate electrode is asingle piece electrode.
 10. The thin film transistor of claim 7, whereinthe source and drain electrodes and the gate electrode are made of thesame material.
 11. The thin film transistor of claim 7, wherein theoxide semiconductor contains zinc oxide (ZnO).
 12. A method ofmanufacturing a thin film transistor, comprising: forming ansemiconductor active layer over a substrate; forming a gate insulatinglayer over the substrate and the active layer; forming i) source anddrain electrodes, electrically connected to the active layer, on thegate insulating layer and ii) a gate electrode between the source anddrain electrodes, wherein the gate electrode is spaced apart from thesource electrode so as to define a first offset region therebetween, andwherein the gate electrode is spaced apart from the drain electrode soas to define a second offset region therebetween; forming a passivationlayer on i) the gate insulating layer, ii) the source and drainelectrodes and iii) the gate electrode; and forming at least oneauxiliary gate electrode on the passivation layer, wherein at least aportion of the auxiliary gate electrode is located directly above thefirst and second offest regions.
 13. The method of claim 12, wherein theforming the source and drain electrodes, and the gate electrodecomprises: forming a contact hole on the gate insulating layer to exposea predetermined part of the active layer; forming a conductive layer onthe gate insulating layer to fill the contact hole; and forming thesource and drain electrodes and the gate electrode by patterning theconductive layer.
 14. The method of claim 12, wherein the at least oneauxiliary gate electrode comprises first and second auxiliary gateelectrodes which are spaced apart from each other, wherein at least aportion of the first auxiliary gate electrode is located directly abovethe first offest region, and wherein at least a portion of the secondauxiliary gate electrode is located directly above the second offestregion.
 15. The method of claim 12, wherein at least a portion of theauxiliary gate electrode overlaps with the gate electrode.
 16. Anorganic light emitting display device, comprising: a first substrate; asecond substrate disposed to face the first substrate, an organic lightemitting device interposed between the first and second subtrates,wherein the organic light emitting device comprises a first electrode,an organic light emitting layer, a second electrode and a thin filmtransistor configured to control an operation of the organic lightemitting device; and wherein the thin film transistor comprises: asubstrate; an active layer formed over the substrate, wherein the activelayer is formed of an oxide semiconductor; a gate insulating layerformed over the substrate and the active layer; source and drainelectrodes formed on the gate insulating layer and electricallyconnected to the active layer; a gate electrode formed on the gateinsulating layer and formed between the source and drain electrodes,wherein the gate electrode is spaced apart from the source electrode soas to define a first offset region therebetween, and wherein the gateelectrode is spaced apart from the drain electrode so as to define asecond offset region therebetween; a passivation layer formed on i) thegate insulating layer, ii) the source and drain electrodes and iii) thegate electrode; and at least one auxiliary gate electrode formed on thepassivation layer, wherein at least a portion of the auxiliary gateelectrode is located directly above the first and second offest regions.17. The organic light emitting display device of claim 16, wherein thesource and drain electrodes are electrically connected to the activelayer through a contact hole formed on the gate insulating layer. 18.The organic light emitting display device of claim 16, wherein at leastpart of the auxiliary gate electrode overlaps with the gate electrode.19. The organic light emitting display device of claim 16, wherein theat least one auxiliary gate electrode comprises first and secondauxiliary gate electrodes which are spaced apart from each other,wherein at least a portion of the first auxiliary gate electrode islocated directly above the first offest region, and wherein at least aportion of the second auxiliary gate electrode is located directly abovethe second offest region.
 20. The organic light emitting display deviceof claim 16, wherein the auxiliary gate electrode and the firstelectrode are made of the same material on the same plane.